TP005-0A1
Product Overview
The TP005-0B1 is a 16×16 array infrared thermal imaging device in which each pixel incorporates a thermopile. When there is a temperature difference between the object under test and the ambient environment, the object’s infrared radiation is absorbed by the thermopile, causing the hot junction of the thermopile to heat up. According to the Seebeck effect, when a temperature difference exists between the cold and hot ends of the thermopile, a corresponding voltage is generated at the output terminal. The TP005-0B1 features an integrated ASIC that amplifies the thermopile signal and performs analog-to-digital conversion. A digital signal processing circuit then applies calibration and compensation to the digitized signal, ultimately delivering the surface temperature of the object under test.
The TP005-0B1 is packaged in the TO-39 form factor. An external MCU can communicate with the TP005-0B1 via the I²C interface to read the device’s calibration coefficients and temperature output values, or to adjust the device’s configuration. The TP005-0B1 integrates an ambient temperature sensor internally, providing a temperature reference for infrared temperature measurement.
Product Applications
- Non-contact temperature measurement
- In-vehicle Comfort Air Conditioning
- Washing machine/dryer
- Microwave oven
- Industrial Control
- Smart Building
- Fire Monitoring
Product Information
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Parameters Test Conditions Minimum value Typical value Maximum value Unit Supply voltage 3.0 3.3 3.6 V Supply current Normal mode 10 milliampere Sleep mode 10 microampere Noise Equivalent Temperature Difference (NETD) 1Hz 140 mK Frame rate 0.5 64 Hertz Communication Interface I²C Field of view 90°×90° ° Package type 4-pin TO39 Operating temperature range -20 105 degrees Celsius Target Temperature Range -40 300 degrees Celsius RoHS Compliant
Chinese Chips Powering AI & New Energy Revolution
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Room 2-709, Building 1, Zijin Oriental, No. 288 Qiyue Street, Suzhou Industrial Park
